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(重要新聞,
2007年8月27日 )
德州儀器 (TI) 宣佈推出一款Sub-1GHz射頻收發器CC1101。此元件具備低耗電、高整合和強大射頻效能等優點，專門支援低耗電無線應用，例如警示與安全、自動讀錶、工業監視與控制、以及家庭和大樓自動化。此外，CC1101與TI相當成功的CC1100 .... |
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(重要新聞,
2007年8月7日 )
英飛凌科技（Infineon Technologies AG）宣布，精工精密株式會社（Seiko Instruments Inc，SII）選用了英飛凌開發的SMARTi® 3G單晶片CMOS射頻（RF）收發器，日後將應用於UMTS/HSDPA資料卡。SII是日本射頻資料通訊卡的龍頭供應商，該公司型號C01SI .... |
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(產品新聞,
2007年7月25日 )
RF Micro Devices (RFMD) has shipped its 100 millionth WCDMA cellular front end. RFMD is the wireless industry's first company to ship 100 million WCDMA front ends for 3G handsets. RFMD attributes the .... |
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(產品新聞,
2007年6月26日 )
ARC Wireless Solutions Inc.'s Wireless Communications Solutions Division announces that the ARC IES, Integrated Enclosure System, has been fully launched and is already being shipped to OEMs and distributors .... |
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(產品新聞,
2007年6月14日 )
CSR will be sampling the industry's first ULP (Ultra Low Power) Bluetooth silicon with a number of lead customers this year with silicon available in 2008. Previously known as Wibree, ULP Bluetooth is .... |
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(產品新聞,
2007年6月14日 )
SkyCross has announced a partnership with Beceem Communications to provide complete, integrated WiMAX solutions for last-mile broadband connectivity. The bundling of Beceem chipsets and SkyCross antennas .... |
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(產品新聞,
2007年6月7日 )
Skyworks Solutions Inc. has unveiled the first of several forthcoming direct demodulators for use in various wireless communication applications, including WiMAX and cellular infrastructure. The SKY73012, .... |
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(產品新聞,
2007年6月6日 )
NXP Semiconductors is collaborating with Taiwan-based design house Afa Technologies to develop ultra-low power DVB-T front-end solutions for portable devices. The first of the collaborative platforms .... |
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(技術新聞,
2007年6月4日 )
NXP, the independent semiconductor company founded by Philips, today launched the BLF878, the world’s first true 300W ultra-high frequency (UHF) transistor in High Voltage Generation 6 LDMOS. The new .... |
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(技術新聞,
2007年6月4日 )
TriQuint Semiconductor recently launched its first three packaged devices in its Multi-Function Circuit (MFC) family. Initially released as die-level devices in November 2006, these devices are now available .... |
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