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Designed for superior audio performance in feature-rich cellphones, STMicroelectronics' EMIF06-AUD01F2 implements the complete EMI (electromagnetic interference) filtering and ESD (electrostatic discharge) protection for stereo headset output and external and internal microphones within a flip-chip package measuring 2.42 x 1.92mm.



The EMIF06-AUD01F2 eliminates audible handset demodulation noise, or "bumble-bee" noise, by achieving -25dB attenuation (S21) throughout the stop-band 800MHz to 2.48GHz using high-density 1.3nF PZT (lead, zirconate titanate) capacitors on the microphone lines. The device also achieves high ESD protection through the combination of integrated TVS (transient voltage suppressor) diodes, low-inductance packaging, and the Z-R-Z pi-filter topology.



As the first device to combine filtering and ESD protection for all handset speaker and microphone channels, the EMIF06-AUD01F2 saves more than 50 percent of board space compared to previous integrated solutions using two ICs with external resistors, and up to 77 percent compared to alternative discrete solutions. All necessary biasing circuitry is also integrated, as well as a 10¦¸ series resistor in the speaker output, thereby minimizing external components. The low package profile of 0.65mm also helps designers implement high functionality within cutting-edge, ultra-slim handset styles.



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