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利用Comlent TD-SCDMA收發器成功地撥打電話(英文內容)
(技術新聞, 2006年11月13日)
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Comlent Technology, China's radio-frequency integrated circuit (RFIC) design house, announced that its transceiver for 3G mobile terminals (TD-SCDMA standard) successfully completed a phone call on a TD-SCDMA network. Comlent is the first Chinese RFIC chip company to achieve this milestone. Strong local transceiver and baseband IC (BBIC) chipset support could further accelerate the technology readiness for China's upcoming 3G deployment. Previously, only two U.S. companies were providing TD-SCDMA transceiver samples to five BBIC chip companies and over twenty mobile terminal design houses in China.
As the world's largest mobile handset market, China's total number of mobile subscribers is projected to reach 441 million by the end of this year, with annual growth of approximately 50 million, according to the China Ministry of Information Industry (MII). China also manufactures most of the world's mobile handsets for both domestic and overseas markets. According to MII, in 2005, China manufactured approximately 290 million mobile handsets, or over 40% of the world's projected total handset output in the year.
http://www.comlent.com/en/news/content.php?id=92
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