­º­¶
2008¦~12¤ë5¤é 
 ·j¯Á:



     
 
 
     
 
 
§Þ³N·s»D > 2006¦~6¤ë8¤é
 
 

Atheros¤ÎBroadcomÅçÃÒ¹L802.11n¯ó®×¸Ñ¨M¤è®×ªº¤¬³q©Ê(­^¤å¤º®e)


(§Þ³N·s»D, 2006¦~6¤ë8¤é)

Atheros Communications and Broadcom have announced interoperability between their draft 802.11n solutions. During the last month, the companies have jointly conducted interoperability testing between Atheros' XSPAN and Broadcom Intensi-fi chipsets. Tests have verified that the wireless LAN (WLAN) solutions work together at throughput speeds greater than 100 Megabits-per-second (Mbps), using mandatory modes of the IEEE 802.11n specification (draft 1.0).



Cross-vendor interoperability testing demonstrates the commitment of Wi-Fi(R) technology leaders to meet growing consumer demand for high-performance products that work seamlessly together. As 802.11n technology further expands beyond PCs and networking gear, into mobile and entertainment devices, interoperability allows consumers to choose a variety of products and brands without worrying about compatibility issues.



This is expected to be a series of interoperability tests conducted with leading wireless companies to broaden the scope of interoperable systems. Over the coming months, the testing will lay the groundwork for successful Wi-Fi Alliance testing when the organization's certification process is finalized.



"The excellent performance demonstrated between Atheros and Broadcom devices shows that the 802.11n draft, when adhered to and properly implemented, supports multi-vendor interoperability," said Bill McFarland, chief technology officer of Atheros. "As the market moves toward these interoperable 802.11n draft chipsets, consumers will be able to purchase a wide range of networking gear from numerous vendors that interoperate at unprecedented speeds."



http://investors.atheros.com/phoenix.zhtml?c=149102&p=irol-newsArticle&t=Regular&id=862121&

 
 
 
 
 
 
 
¬ÛÃö¤å³¹
   

¾A¥Î©óM2MµL½u³q°TÀ³¥Îªº¦w¥þMCU

¤¤¶ZÂ÷UHF RFID Gen2Ū¨ú¾¹

New Products

TGn Synch¡BWwiSE¡B¤ÎMITMOT Groups¦X¤Oµo®i802.11nªº«ØÄ³®Ñ

Wi-MeshÁp·ù¥¿¦¡¦VIEEE 802.11¨ó©w¨î©w¤p²Õ´£¥æ«ØÄ³®Ñ

Smart Active Label ¤½·|¬°ISO RFID¼Ð·Ç¼W²K·s¥\¯à

WiMAX±N¦b2007¦~°_­¸

¨T¨®ÂŪޥ«³õ±Nµø¼Ð·Ç¹ê¬Iªº±¡§Î¦Ó©w

WCDMA¤¸¥óªº¨ÑÀ³¼W¥[

Ember·s¼WZigBee¤Jªù¯Åµo®i¤u¨ã

   
 
­«­n·s»D
   

Proxim­º¦¸¬ð¯}802.11n¤è®×300 Mbpsªº³t«×­­¨î¡A¨ÏµL½u°Ï°ìºô¸ô¦¨¥»´î¥b

·R¯S±öº¸¸gÅçÃҨ㦳³Ì°ª¾É¯èºë«×ªºGPS³æ´¹¤ù±µ¦¬¾¹IC²{¤w²Å¦X¨T¨®«~½è­n¨D

­^­¸­â°w¹ï GPS À³¥Îµ{¦¡±À¥X¥þ²y³Ì¤pªº¥þ¾ã¦X¦¡±µ¦¬«eºÝ¼Ò²Õ

­^­¸­â°w¹ï GPS À³¥Îµ{¦¡±À¥X¥þ²y³Ì¤pªº¥þ¾ã¦X¦¡±µ¦¬«eºÝ¼Ò²Õ

KEITHLEY±À¥XSIGNALMEISTER™ ®gÀW³q°T¤u¨ã³nÅé

°ª³qSnapdragon ¥­¥x§ð¥e¦æ°Ê¹Bºâ¸Ë¸m¥«³õ

¼w¦{»ö¾¹­P¤O¤ä«ù¶}©ñ¤â¾÷Áp·ù¤Î¶}©ñ­ì©l½XªÀ¸s

ARM Profiler¤ä´©Symbian§@·~¨t²Î

³Ð¾U°TAtheros ±À¥X802.11n 1-Stream³W®æªºAlign™§Þ³N

IDT¬°°ª¶¥¤â¾÷´£¨Ñ°ª³]­p¼u©Ê¡B§C¥\¯Ó¡B«D¦P¨BÂù°ð¤¶­±²£«~

   
 
 
 
 
     
 
¬ÛÃö²£·~
   
Photonics Association (Singapore)
 
Singapore Industrial Automation Association (SIAA)
 
Taiwan Semiconductor Industry Association (TSIA)
   
 
spacer
ÃÙ§U°Ó³sµ²
 
spacer
 


 
 
 
 
 
§Þ³N´ë¹D

©ñ¤j¾¹

¤¸¥ó

¼Æ¦ìµwÅé/¤¸¥ó

¾ã¦X¤¸¥ó

¾ã¦X¤l¨t²Î

¤¶­±/¤¬³s

§÷®Æ

³Q°Ê¤¸¥ó

¥\²v

¥b¾ÉÅé/¿nÅé¹q¸ô/·Lªi³æ¤ù¿nÅé¹q¸ô

ªA°È

«H¸¹³B²z

«H¸¹·½

³nÅé

´ú¸Õ»P¶q´ú

¶Ç¿é¤¸¥ó

µL½u¨ó©w

 

©j©fºô¯¸
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.